chip attenuator design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 1.0 mm 1.0 mm (inches : 0404) type attenuator one-digit number /one letter shows attenuation value (ex.) 1 1 db, a 10 db thick film resistor network e 1 x 2 b 3 2 4 4 56 t 7 3 8 a 9 r 10 3 x 11 12 a r3 0.3 db r5 0.5 db product code attenuation value tolerance dimensions and circuit configuration a50 characteristics impedance punched carrier taping (2 mm pitch) x packaging frequency (hz) attenuation (db) 1db 2db 3db 4db 5db 6db 10db 11 10 9 8 7 6 5 4 3 2 1 0 30 k 100 k 10 m 1m 100 m 3 g 1g features unbalanced type attenuator circuit in one chip(1.0 mm 1.0 mm) mounting area reduced : abou t 50 % reduction compared with an attenuator circuit consisting of three 1005 (inches:0402) chip resi stors (almost equal to an attenuator circuit consisting of three 0603 (inches:0201) chip resistors) mounting cost reductio n : (only 1 chip placed as compared to 3) attenuation : 1 db to 10 db chip attenuator 0404 type: exb24at attenuation-frequency characteristics (typical) explanation of part numbers recommended applications attenuation / level control / impedance matching of high frequency (communication signalling equipment cellular phones(gsm, cdma, pdc, etc.), phs, pdas) feb. 2006
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. chip attenuator protective coating thick film r esistive element electrode (inner) electrode (between) electrode (outer) alumina substrate r 1 r 2 r 2 unbalanced type 12 43 a b w c t p l 43 12 ?0 ?0 0 20 40 60 80 100 120 140 160 0 ?0 70 c ?5 c 20 40 60 80 100 120 125 c ambient temperature ( c) rated power (%) di men sions (mm) lwt ab 1.00 ?.10 1.00 ?.10 0.35 ?.10 0.33 ?.10 0.15 ?.10 di men sions (mm) cp(typical value) 0.25 ?.10 0.65 construction circuit con? guration dimensions (not to scale) the bar ma rking for recognizing terminal direction is located on the side of terminal 4. mass (weight) [1 000 pcs.] : 1.1 g ratings power derati ng curve for resistors operated in ambient temperature above 70 c, powe r rating shall be derated in accordance with the gure on the right. ? please inquir e about the other attenuator value item spec i ? ca tions attenuation value 1 db, 2 db, 3 db, 4 db, 5 db, 6 db, 10 db ? attenuation value tolerance 1 db, 2 db, 3 db, 4 db, 5 db : ?.3 db 6 db, 10 db : ?.5 db characteristic impedance 50 power rating 0.04 w /package frequency range dc to 2.2 ghz vswr (voltage standing wave ratio) 1.3 max. numb er of resistors 3 resistors numb er of terminals 4 terminals category temperature range (operating temperature range) ?5 c to +125 c feb. 2006
chip attenuator design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. f b w t f a f c a c c' p 1 p 0 sprocket hole compartment direction of feed p 2 f d 0 c?' t e f b w a d c b conductor solder resist packaging methods (taping) standard quantity type kind of taping pitch (p 1 )quantity exb24at pu nc he d ca rr ie r ta pi ng 2 mm 1 0000 pcs./reel taping reel punched carrier tap ing recommended land pattern (mm) products shall be sealed as to locate the terminal 1 and 2 on the side of feeding direction in the chip pocket. di men sions (mm) abwf e 1.20 ?.10 1.20 ?.10 8.00 ?.20 3.50 ?.05 1.75 ?.10 ? di men sions (mm) p 0 p 1 p 2 f d 0 t 4.00 ?.10 2.00 ?.10 2.00 ?.05 1.50 +0.10 0.45 ?.10 di men sions (mm) f a f b f cw t 180.0 +0 60 min. 13.0 ?.0 9.0 ?.0 11.4 ?.0 ?.0 di men sions (mm) abcd 0.5 0.35 to 0.4 0.3 1.4 to 1.5 feb. 2006
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. chip attenuator preheating peak heating temperature time temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s recommended soldering conditions recommendations and precau tions are described below. recommended so ldering conditions for re ow for solderin g (example : sn/pb) for lead-fre e soldering (example : sn/ag/cu) safety precautions flow soldering we do not recommend ow soldering, be cause solder bridging may occur due to the narrow 0.65 mm pitch. the following ar e precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er3 of this catalog. 1. take measures ag ainst mechanical stress during and after mounting of chip attenuator (hereafter called the re sis tors) so as not to damage their electrodes and protective coatings. be carefu l not to misplace the resistors on the land patterns. otherwise, solder bridging may occur. 2. if a transien t load (heavy load in a short time) like a puls e is expected to be applied, check and eval u ate th e op er a tions of the resistors when installed in your products before use. never exceed the rated power. otherwise, the performance and/ or reliab ility of the resistors may be impaired. 3. do not us e halogen-based or other high-activity ux. otherwise, the residue may impair the resistors' per for mance and/or re liability. 4. when soldering with a soldering iron, never touch the resist ors' bodies with the tip of th e soldering iron. when using a soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amounts of solder. 6. do not apply sh ock to th e resistors or pinch them with a hard tool (e.g. pliers and tweezers). oth er wise, the re sis tors' protective coatings and bodies may be chipped, affecting their performance. 7. avo id exc e s s i ve b e n d ing of printed circuit boards in order to protect the resistors from abnormal stress. ?re ow soldering shall be performed a maximum of two times. ?please contact us for additional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. feb. 2006
? er3 ? safety precautions (common precautions for fixed resistors) when using ou r products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the speci? cations with us in advance. the design and speci? cations in this catalog are subject to change without prior notice. do not use the products beyond the speci? cations described in this catalog. this cata log explains the quality and performance of the products as individual components. be fore use, check and evaluate their operations when installed in your products. install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause th e loss of human life or other signi? cant damage, such as damage to vehicles (au to mo bile, train, vessel), traf? c lights, medical equipment, aerospace equipment, elec tric heating ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment. ? systems equipped with a protection circuit and a protection device ? systems equip ped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) precauti ons fo r use these products are designed and manufactured for general and stan dard use in general elec tron ic equipment (e.g. av equipm ent, home el ectric ap pli anc es, of? ce equipment, information and com mu ni ca tion equipment) these products are not intended for use in the following special conditions. be fore u sing the products, care ful ly check the effects on their quality and performance, and determine whether or not they can be used. 1. in liquid, such as water, oil, chemicals, or organic solvent 2. in direct sunlight, outdoors, or in dust 3. in salty air or air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 4. electric static discharge (esd) environment these components are sensitive to static electricity and can be damaged under static shock (esd). please take measures to avoid any of these environments. smaller componen ts are more sensitive to esd environment. 5. electromagnetic environment avoid any enviro nment where stro ng electromagnetic waves exist. 6. in an environment where these pr oducts cause dew condensation 7. s e a li n g o r c o ating of these products or a printed circuit board on which thes e products are mounted, with resin or othe r materials these products generate joule heat when energized. carefu lly position th ese products so that their heat will not affect th e other components. carefully position thes e products so that their temperatures will not exceed the category temperature range due to the effect s of neighboring heat-generating com po nents. do not mount or place heat-generating com po nents or in? ammables, such as vinyl-coated wires, near these products . note that non- cleaning solder, halogen-based highly active ? ux, or water-soluble ? ux may dete riorate the performance or reliab ility of the products. carefully select a ? ux cleaning agent fo r use after soldering. an unsuit able agent may deteriorate the performance or reliability. in particular, when using water or a water-soluble cleaning agent, be careful not to leave water res i dues. otherwise, the insulation performance may be deteriorated. (2) precaution s for storage the performance of these products, including the solderability, is guaran teed fo r a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 c to 35 c and a relative humidity of 45 % to 85 %. even wi thin the above guarantee periods, do not store these products in the fol low ing conditions. otherwise, their elec tri cal performance and/or solderability may be dete riorated, and the packaging materials (e.g. tap ing ma te ri als) may be de formed or dete riorated, resulting in mounting failures. 1. in salty air or in air with a high concentration of corrosive gas, such as cl 2 , h 2 s, nh 3 , so 2 , or no 2 2. in direct sunlight package ma rkings include the product number, quantity, and country of origin. in principle, the country of origin should be indicated in english. feb. 2006
|
